18-0518-00 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 18POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (1 x 18)
Type: SIP
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
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Technische Details 18-0518-00 Aries Electronics
Description: CONN SOCKET SIP 18POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (1 x 18), Type: SIP, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Bulk.
Weitere Produktangebote 18-0518-00
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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18-0518-00 | Hersteller : Aries Electronics |
IC & Component Sockets SURFACE MOUNT COLLET SINGLE ROW 18 PINS |
Produkt ist nicht verfügbar |