18-822-90EWR Aries Electronics
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Bulk
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Technische Details 18-822-90EWR Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 18-822-90EWR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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18-822-90EWR | Hersteller : Aries Electronics |
IC & Component Sockets THRIFTY VERTISOCKETS BIFURCATED 18 PINS |
Produkt ist nicht verfügbar |