180-PGM18006-10 Aries Electronics
Hersteller: Aries Electronics
Description: PIN GRID ARRAY SOCKET 180PIN
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Type: PGA
Mounting Type: Through Hole
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
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Technische Details 180-PGM18006-10 Aries Electronics
Description: PIN GRID ARRAY SOCKET 180PIN, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Type: PGA, Mounting Type: Through Hole, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm).
Weitere Produktangebote 180-PGM18006-10
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| 180-PGM18006-10 | Aries Electronics |
 IC & Component Sockets PIN GRID ARRAY SOLDER TAIL 180 PINS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 180-PGM18006-10 |
|
Hersteller: Aries Electronics
IC & Component Sockets PIN GRID ARRAY SOLDER TAIL 180 PINS
IC & Component Sockets PIN GRID ARRAY SOLDER TAIL 180 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH