18050831 HELU
Hersteller: HELU
Category: Copper Braids and Wires
Description: Braids; braid; 2÷4mm; Body dim: 16x6x0.15mm; 25m; copper strand
Type of wire: braids
Kind of braid: braid
Braid inside diameter: 2...4mm
Braid structure: tinned copper wires
Body dimensions: 16x6x0.15mm
Package contents: 25m
Trade name: copper strand
| Anzahl | Preis |
|---|---|
| 50+ | 1.69 EUR |
| 100+ | 1.44 EUR |
| 250+ | 1.36 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 18050831 HELU
Description: CONN SOCKET SIP 18POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (1 x 18), Termination: Wire Wrap, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote 18050831
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 18-0508-31 | Hersteller : Aries Electronics |
Description: CONN SOCKET SIP 18POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (1 x 18) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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18-0508-31 | Hersteller : Aries Electronics |
IC & Component Sockets SINGLE ROW COLLET WIRE WRAP 18 PINS |
Produkt ist nicht verfügbar |
