Produkte > ARIES ELECTRONICS > 184-PRS15075-12

184-PRS15075-12 Aries Electronics


Hersteller: Aries Electronics
Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 184
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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Technische Details 184-PRS15075-12 Aries Electronics

Description: SOCKET, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -65°C ~ 125°C, Number of Positions or Pins (Grid): 184, Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.

Weitere Produktangebote 184-PRS15075-12

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184-PRS15075-12 Hersteller : Aries Electronics IC & Component Sockets
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH