Suchergebnisse für "186513" : 19
Art der Ansicht :
Im Einkaufswagen
Stück im Wert von UAH
Mindestbestellmenge: 4
Im Einkaufswagen
Stück im Wert von UAH
Im Einkaufswagen
Stück im Wert von UAH
Im Einkaufswagen
Stück im Wert von UAH
Im Einkaufswagen
Stück im Wert von UAH
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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SN74ALS245ADWR Produktcode: 186513
zu Favoriten hinzufügen
Lieblingsprodukt
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Produkt ist nicht verfügbar
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Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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18-6513-10 | Aries Electronics |
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auf Bestellung 389 Stücke: Lieferzeit 10-14 Tag (e) |
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18-6513-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 285 Stücke: Lieferzeit 10-14 Tag (e) |
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1865-13G-KDN | Honeywell Sensing and Productivity Solutions |
![]() Features: Temperature Compensated Packaging: Bulk Package / Case: 8-DIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV Operating Pressure: 15PSI (103.42kPa) Pressure Type: Vented Gauge Accuracy: ±0.25% Operating Temperature: -28°C ~ 54°C Termination Style: PC Pin Voltage - Supply: 15V Port Style: No Port Maximum Pressure: 45PSI (310.26kPa) Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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1865-13G-KDN | Honeywell |
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auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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1-2186513-1 | TE Connectivity AMP Connectors |
![]() Packaging: Box For Use With/Related Products: T3212 and T3224 Printers Accessory Type: Control Panel |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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18-6513-10H | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
18-6513-10H | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
18-6513-10T | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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18-6513-10T | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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18-6513-11 | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
18-6513-11 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
18-6513-11H | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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18-6513-11H | Aries Electronics |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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1865-13G-KDN | Honeywell |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
1865-13G-LDN | Honeywell Sensing and Productivity Solutions |
Description: SENSOR 15PSIG 0.1V Features: Temperature Compensated Packaging: Bulk Package / Case: 8-DIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 100 mV Operating Pressure: 15PSI (103.42kPa) Pressure Type: Vented Gauge Accuracy: ±0.25% Operating Temperature: -28°C ~ 54°C Termination Style: PC Pin Port Style: No Port Maximum Pressure: 45PSI (310.26kPa) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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1865-13G-LDN | Honeywell |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
1865139 | Phoenix Contact | CH-NAL RESEARCH-M12-RJ45-50M |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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T3200-PRINTER-CONTROL-PANEL | TE Connectivity / AMP |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
SN74ALS245ADWR Produktcode: 186513
zu Favoriten hinzufügen
Lieblingsprodukt
|
![]() |
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-6513-10 |
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Hersteller: Aries Electronics
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
auf Bestellung 389 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 5.35 EUR |
10+ | 4.52 EUR |
250+ | 4.01 EUR |
500+ | 3.41 EUR |
1000+ | 3.24 EUR |
2500+ | 3.06 EUR |
18-6513-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 285 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.26 EUR |
10+ | 4.46 EUR |
27+ | 4.16 EUR |
54+ | 3.96 EUR |
108+ | 3.77 EUR |
270+ | 3.54 EUR |
1865-13G-KDN |
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Hersteller: Honeywell Sensing and Productivity Solutions
Description: SENSOR 15PSIG .04V
Features: Temperature Compensated
Packaging: Bulk
Package / Case: 8-DIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV
Operating Pressure: 15PSI (103.42kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.25%
Operating Temperature: -28°C ~ 54°C
Termination Style: PC Pin
Voltage - Supply: 15V
Port Style: No Port
Maximum Pressure: 45PSI (310.26kPa)
Part Status: Active
Description: SENSOR 15PSIG .04V
Features: Temperature Compensated
Packaging: Bulk
Package / Case: 8-DIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV
Operating Pressure: 15PSI (103.42kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.25%
Operating Temperature: -28°C ~ 54°C
Termination Style: PC Pin
Voltage - Supply: 15V
Port Style: No Port
Maximum Pressure: 45PSI (310.26kPa)
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 287.92 EUR |
5+ | 287.44 EUR |
1865-13G-KDN |
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Hersteller: Honeywell
Board Mount Pressure Sensors PRES XDCR 15 PSI GAGE 10VDC
Board Mount Pressure Sensors PRES XDCR 15 PSI GAGE 10VDC
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 375.48 EUR |
5+ | 339.12 EUR |
10+ | 327.92 EUR |
1-2186513-1 |
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Hersteller: TE Connectivity AMP Connectors
Description: T3200-PRINTER-CONTROL-PANEL
Packaging: Box
For Use With/Related Products: T3212 and T3224 Printers
Accessory Type: Control Panel
Description: T3200-PRINTER-CONTROL-PANEL
Packaging: Box
For Use With/Related Products: T3212 and T3224 Printers
Accessory Type: Control Panel
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 777.67 EUR |
18-6513-10H |
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Hersteller: Aries Electronics
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-6513-10H |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-6513-10T |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-6513-10T |
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Hersteller: Aries Electronics
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-6513-11 |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-6513-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-6513-11H |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
18-6513-11H |
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Hersteller: Aries Electronics
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
IC & Component Sockets LO-PRO FILE COLLET SOLDER TAIL 18 PINS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1865-13G-KDN |
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Hersteller: Honeywell
Gage Pressure Sensor
Gage Pressure Sensor
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1865-13G-LDN |
Hersteller: Honeywell Sensing and Productivity Solutions
Description: SENSOR 15PSIG 0.1V
Features: Temperature Compensated
Packaging: Bulk
Package / Case: 8-DIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 100 mV
Operating Pressure: 15PSI (103.42kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.25%
Operating Temperature: -28°C ~ 54°C
Termination Style: PC Pin
Port Style: No Port
Maximum Pressure: 45PSI (310.26kPa)
Description: SENSOR 15PSIG 0.1V
Features: Temperature Compensated
Packaging: Bulk
Package / Case: 8-DIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 100 mV
Operating Pressure: 15PSI (103.42kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.25%
Operating Temperature: -28°C ~ 54°C
Termination Style: PC Pin
Port Style: No Port
Maximum Pressure: 45PSI (310.26kPa)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1865-13G-LDN |
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Hersteller: Honeywell
Board Mount Pressure Sensors 1865 FORCE SENSOR 15 PSIG CURRENT EXCIT.
Board Mount Pressure Sensors 1865 FORCE SENSOR 15 PSIG CURRENT EXCIT.
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1865139 |
Hersteller: Phoenix Contact
CH-NAL RESEARCH-M12-RJ45-50M
CH-NAL RESEARCH-M12-RJ45-50M
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
T3200-PRINTER-CONTROL-PANEL |
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Hersteller: TE Connectivity / AMP
Printers T3200-PRINTER CONTROL-PANEL
Printers T3200-PRINTER CONTROL-PANEL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH