19-0501-30 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 19POS TIN
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 19 (1 x 19)
Operating Temperature: -55°C ~ 105°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
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Technische Details 19-0501-30 Aries Electronics
Description: CONN SOCKET SIP 19POS TIN, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 19 (1 x 19), Operating Temperature: -55°C ~ 105°C, Type: SIP, Mounting Type: Through Hole, Packaging: Bulk, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin.
Weitere Produktangebote 19-0501-30
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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19-0501-30 | Hersteller : Aries Electronics |
IC & Component Sockets STRIP LINE BIFURCATE 19 PINS TIN |
Produkt ist nicht verfügbar |
