19-0517-90C Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
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Technische Details 19-0517-90C Aries Electronics
Description: CONN SOCKET SIP 19POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Type: SIP, Number of Positions or Pins (Grid): 19 (1 x 19), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 19-0517-90C
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
19-0517-90C | Hersteller : Aries Electronics | IC & Component Sockets PIN LINE VERTISOCKET 19 PINS |
Produkt ist nicht verfügbar |