Technische Details 1981837-1 TE Connectivity
Description: CONN SOCKET LGA 1366POS GOLD, Packaging: Tray, Features: Open Frame, Mounting Type: Surface Mount, Type: LGA, Number of Positions or Pins (Grid): 1366 (32 x 41), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.040" (1.01mm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 1981837-1
| Foto | Bezeichnung | Hersteller | Beschreibung |
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1981837-1 | Hersteller : TE Connectivity AMP Connectors |
 Description: CONN SOCKET LGA 1366POS GOLDPackaging: Tray Features: Open Frame Mounting Type: Surface Mount Type: LGA Number of Positions or Pins (Grid): 1366 (32 x 41) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.040" (1.02mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.040" (1.01mm) Contact Material - Post: Copper Alloy |
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