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2-1571550-6 TE Connectivity

DDEController?Action=srchrtrv&DocNm=1571550&DocType=Customer+Drawing&DocLang=English Hersteller: TE Connectivity
Category: Semiconductors - accessories - Unclass.
Description: 2-1571550-6
auf Bestellung 2293 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis
24+7.59 EUR
96+6.74 EUR
216+6.61 EUR
360+6.48 EUR
1008+6.35 EUR
Mindestbestellmenge: 24
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Technische Details 2-1571550-6 TE Connectivity

Description: CONN IC DIP SOCKET 20POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Beryllium Copper.

Weitere Produktangebote 2-1571550-6

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2-1571550-6 Hersteller : TE CONNECTIVITY / PARTNER STOCK product-2-1571550-6.datasheet.pdf Description: TE CONNECTIVITY / PARTNER STOCK - 2-1571550-6 - IC COMPONENT SOCKETS CONNECTORS
tariffCode: 85366990
productTraceability: No
rohsCompliant: Y-EX
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: To Be Advised
auf Bestellung 1848 Stücke:
Lieferzeit 14-21 Tag (e)
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2-1571550-6 2-1571550-6 Hersteller : TE Connectivity pgurl_520ag11dlf.pdf Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2-1571550-6 2-1571550-6 Hersteller : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1571550&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH