2-1571550-6 TE CONNECTIVITY / PARTNER STOCK
Hersteller: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 2-1571550-6 - IC COMPONENT SOCKETS CONNECTORS
tariffCode: 85366990
productTraceability: No
rohsCompliant: Y-EX
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: To Be Advised
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Technische Details 2-1571550-6 TE CONNECTIVITY / PARTNER STOCK
Description: CONN IC DIP SOCKET 20POS GOLD, Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10).
Weitere Produktangebote 2-1571550-6
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
2-1571550-6 | TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 20POS GOLD Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Tube Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 25.0µin (0.63µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 960 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 2-1571550-6 |
|
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 20POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Description: CONN IC DIP SOCKET 20POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Produkt ist nicht verfügbar
Mindestbestellmenge: 960 Stücke
Im Einkaufswagen
Stück im Wert von UAH