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2-1571586-8

2-1571586-8 TE Connectivity

ENG_CD_1571586_B2-2011857.pdf
Hersteller: TE Connectivity
IC & Component Sockets 824-AG11D-LF=800 DIP PCB AU/SN
auf Bestellung 409 Stücke:
Lieferzeit 10-14 Tag (e)
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Technische Details 2-1571586-8 TE Connectivity

Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Copper.

Weitere Produktangebote 2-1571586-8

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2-1571586-8 Hersteller : TE CONNECTIVITY / PARTNER STOCK DDEController?Action=srchrtrv&DocNm=1571586&DocType=Customer+Drawing&DocLang=English Description: TE CONNECTIVITY / PARTNER STOCK - 2-1571586-8 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE 800, 15.24 mm
tariffCode: 85369010
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 24Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: DIPLOMATE 800
SVHC: To Be Advised
auf Bestellung 1467 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
2-1571586-8 Hersteller : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1571586&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Material - Post: Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH