Produkte > TE CONNECTIVITY AMP CONNECTORS > 2-382467-1

2-382467-1 TE Connectivity AMP Connectors

382467.pdf
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
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Technische Details 2-382467-1 TE Connectivity AMP Connectors

Description: CONN IC DIP SOCKET 28POS TIN, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.