2-640361-4 TE Connectivity

Description: CONN IC DIP SOCKET 24POS GOLD, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.