20-35W000-11-RC Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 54.12 EUR |
| 19+ | 48.64 EUR |
| 57+ | 45.99 EUR |
| 114+ | 43.63 EUR |
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Technische Details 20-35W000-11-RC Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3, Part Status: Active, Package Accepted: SOIC, Proto Board Type: SMD to DIP, Board Thickness: 0.062" (1.57mm) 1/16", Pitch: 0.050" (1.27mm), Number of Positions: 20, Material: FR4 Epoxy Glass, Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm), Packaging: Bulk.
Weitere Produktangebote 20-35W000-11-RC
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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20-35W000-11-RC | Aries Electronics |
 Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3Part Status: Active Package Accepted: SOIC Proto Board Type: SMD to DIP Board Thickness: 0.062" (1.57mm) 1/16" Pitch: 0.050" (1.27mm) Number of Positions: 20 Material: FR4 Epoxy Glass Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 20-35W000-11-RC |
|
Hersteller: Aries Electronics
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Part Status: Active
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 20
Material: FR4 Epoxy Glass
Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm)
Packaging: Bulk
Description: SOCKET ADAPT SOIC-W TO 20DIP 0.3
Part Status: Active
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.062" (1.57mm) 1/16"
Pitch: 0.050" (1.27mm)
Number of Positions: 20
Material: FR4 Epoxy Glass
Size / Dimension: 2.000" L x 0.500" W (50.80mm x 12.70mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH