200-6311-9UN-1900

200-6311-9UN-1900 3M Electronic Solutions Division


13be68ba59ff4982c06445727b2376fc096f1057-2951101.pdf Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 11X11 SKT KIT WITHOUT CONTACTS
auf Bestellung 20 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+94.79 EUR
5+ 92 EUR
10+ 89.2 EUR
20+ 86.42 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details 200-6311-9UN-1900 3M Electronic Solutions Division

Description: CONN SOCKET PGA ZIF 121POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 121 (11 x 11), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.

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200-6311-9UN-1900 200-6311-9UN-1900 Hersteller : 3M 3mtm-textool-tm-pga-test-and-burn-in-kit-socket-ts0675.pdf Description: CONN SOCKET PGA ZIF 121POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 121 (11 x 11)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar