200-6319-9UN-1900 3M Electronic Solutions Division
| Anzahl | Preis |
|---|---|
| 1+ | 186.26 EUR |
| 10+ | 170.93 EUR |
| 20+ | 164.37 EUR |
| 50+ | 158.88 EUR |
| 100+ | 150.11 EUR |
| 200+ | 145.73 EUR |
| 500+ | 142.42 EUR |
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Technische Details 200-6319-9UN-1900 3M Electronic Solutions Division
Description: CONN SOCKET PGA ZIF 361POS GOLD, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 361 (19 x 19), Operating Temperature: -55°C ~ 150°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Packaging: Bulk.
Weitere Produktangebote 200-6319-9UN-1900
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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200-6319-9UN-1900 | 3M |
Description: CONN SOCKET PGA ZIF 361POS GOLDPart Status: Obsolete Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyethersulfone (PES) Termination: Solder Number of Positions or Pins (Grid): 361 (19 x 19) Operating Temperature: -55°C ~ 150°C Type: PGA, ZIF (ZIP) Mounting Type: Through Hole Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 200-6319-9UN-1900 |
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Hersteller: 3M
Description: CONN SOCKET PGA ZIF 361POS GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 361 (19 x 19)
Operating Temperature: -55°C ~ 150°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN SOCKET PGA ZIF 361POS GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 361 (19 x 19)
Operating Temperature: -55°C ~ 150°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 10 Stücke
Im Einkaufswagen
Stück im Wert von UAH


