200-6319-9UN-1900 3M Electronic Solutions Division
| Anzahl | Privatkunde |
|---|---|
| 1+ | 221.65 EUR |
| 10+ | 203.41 EUR |
| 20+ | 195.6 EUR |
| 50+ | 189.07 EUR |
| 100+ | 178.63 EUR |
| 200+ | 173.42 EUR |
| 500+ | 169.48 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details 200-6319-9UN-1900 3M Electronic Solutions Division
Description: CONN SOCKET PGA ZIF 361POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 361 (19 x 19), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Weitere Produktangebote 200-6319-9UN-1900
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
200-6319-9UN-1900 | 3M |
 Description: CONN SOCKET PGA ZIF 361POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 361 (19 x 19) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 200-6319-9UN-1900 |
|
Hersteller: 3M
Description: CONN SOCKET PGA ZIF 361POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 361 (19 x 19)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Description: CONN SOCKET PGA ZIF 361POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 361 (19 x 19)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 10 Stücke
Im Einkaufswagen
Stück im Wert von UAH