200-6321-9UN-1900 3M
Hersteller: 3M
Description: CONN SOCKET PGA ZIF 441POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 441 (21 x 21)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Description: CONN SOCKET PGA ZIF 441POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 441 (21 x 21)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 230.86 EUR |
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Technische Details 200-6321-9UN-1900 3M
Description: CONN SOCKET PGA ZIF 441POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 441 (21 x 21), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
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