2010300214 Molex
Hersteller: MolexConn Micro SD/Nano SIM Combo Connector SKT 12/14 POS Solder RA SMD 0.5A/Contact T/R
auf Bestellung 14385 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 132+ | 1.11 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 2010300214 Molex
Description: MSD/NSIM 3IN2 1.45H VERTICAL TYP, Packaging: Tray, Features: Switch, Connector Type: Connector and Ejector, Contact Finish: Gold, Mounting Type: Surface Mount, Right Angle, Number of Positions: 15 (14 + 1), Card Type: Combo - microSD™, NANO SIM, Height Above Board: 0.057" (1.45mm), Contact Finish Thickness: 2.00µin (0.051µm), Mounting Feature: Normal, Standard - Top, Ejector Side: Left, Insertion, Removal Method: Push In, Push Out.
Weitere Produktangebote 2010300214
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
|
2010300214 | Hersteller : Molex |
Conn Micro SD/Nano SIM Combo Connector SKT 12/14 POS Solder RA SMD 0.5A/Contact T/R |
Produkt ist nicht verfügbar |
|
| 2010300214 | Hersteller : Molex |
Description: MSD/NSIM 3IN2 1.45H VERTICAL TYPPackaging: Tray Features: Switch Connector Type: Connector and Ejector Contact Finish: Gold Mounting Type: Surface Mount, Right Angle Number of Positions: 15 (14 + 1) Card Type: Combo - microSD™, NANO SIM Height Above Board: 0.057" (1.45mm) Contact Finish Thickness: 2.00µin (0.051µm) Mounting Feature: Normal, Standard - Top Ejector Side: Left Insertion, Removal Method: Push In, Push Out |
Produkt ist nicht verfügbar |