208-7391-55-1902 3M
Hersteller: 3M
Description: CONN SOCKET SOIC 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 229 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 88.06 EUR |
10+ | 77.12 EUR |
30+ | 73.79 EUR |
50+ | 71.41 EUR |
100+ | 69.02 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 208-7391-55-1902 3M
Description: CONN SOCKET SOIC 8POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 208-7391-55-1902 nach Preis ab 65.68 EUR bis 88.4 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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208-7391-55-1902 | Hersteller : 3M Electronic Solutions Division | IC & Component Sockets BURN-IN SOIC SOCKET 8 Leads |
auf Bestellung 26 Stücke: Lieferzeit 14-28 Tag (e) |
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208-7391-55-1902 | Hersteller : 3M |
Description: 3M - 208-7391-55-1902 - IC- & Baustein-Sockel, 8 Kontakt(e), IC-Sockel, 3.81 mm, 208-7391, 1.27 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: IC-Sockel rohsCompliant: YES Rastermaß: 3.81mm Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 1.27mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 208-7391 SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 39 Stücke: Lieferzeit 14-21 Tag (e) |
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208-7391-55-1902 | Hersteller : 3M Interconnect Solutions | Conn SOIC Test Clip SKT 8 POS Solder ST Thru-Hole 8 Port Box |
Produkt ist nicht verfügbar |
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208-7391-55-1902 | Hersteller : 3M Interconnect Solutions | Conn SOIC Test Clip SKT 8 POS Solder ST Thru-Hole 8 Port Box |
Produkt ist nicht verfügbar |
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208-7391-55-1902 | Hersteller : 3M Interconnect Solutions | Conn SOIC Test Clip SKT 8 POS Solder ST Thru-Hole 8 Port Box |
Produkt ist nicht verfügbar |