208-7391-55-1902 3M Electronic Solutions Division
| Anzahl | Privatkunde |
|---|---|
| 1+ | 71.57 EUR |
| 10+ | 60.57 EUR |
| 20+ | 57.6 EUR |
| 50+ | 57.02 EUR |
| 100+ | 54.62 EUR |
| 200+ | 51.21 EUR |
| 500+ | 50.12 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details 208-7391-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 8POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 208-7391-55-1902 nach Preis ab 50.98 EUR bis 80.81 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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208-7391-55-1902 | 3M |
 Description: CONN SOCKET SOIC 8POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 394 Stücke: Lieferzeit 10-14 Tag (e) |
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208-7391-55-1902 | 3M |
Description: 3M - 208-7391-55-1902 - IC- & Baustein-Sockel, 8 Kontakt(e), SOIC-Sockel, 3.81 mm, 208-7391, 1.27 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 8Kontakt(e) SVHC: No SVHC (15-Jan-2018) Reihenabstand: 1.27mm Steckverbinder: SOIC-Sockel Produktpalette: 208-7391 productTraceability: No usEccn: EAR99 Rastermaß: 3.81mm |
auf Bestellung 6 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 208-7391-55-1902 |
|
Hersteller: 3M
Description: CONN SOCKET SOIC 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 394 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 75.27 EUR |
| 10+ | 63.97 EUR |
| 30+ | 59.2 EUR |
| 50+ | 57.11 EUR |
| 100+ | 54.38 EUR |
| 250+ | 50.98 EUR |
| 208-7391-55-1902 |
|
Hersteller: 3M
Description: 3M - 208-7391-55-1902 - IC- & Baustein-Sockel, 8 Kontakt(e), SOIC-Sockel, 3.81 mm, 208-7391, 1.27 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (15-Jan-2018)
Reihenabstand: 1.27mm
Steckverbinder: SOIC-Sockel
Produktpalette: 208-7391
productTraceability: No
usEccn: EAR99
Rastermaß: 3.81mm
Description: 3M - 208-7391-55-1902 - IC- & Baustein-Sockel, 8 Kontakt(e), SOIC-Sockel, 3.81 mm, 208-7391, 1.27 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (15-Jan-2018)
Reihenabstand: 1.27mm
Steckverbinder: SOIC-Sockel
Produktpalette: 208-7391
productTraceability: No
usEccn: EAR99
Rastermaß: 3.81mm
auf Bestellung 6 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 80.81 EUR |
| 5+ | 70.47 EUR |