210-2599-00-0602 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets .1" INLINE ZIP STRIP Socket 10 Contct Qt
| Anzahl | Preis |
|---|---|
| 1+ | 70.4 EUR |
| 10+ | 61.14 EUR |
| 30+ | 57.46 EUR |
| 50+ | 54.98 EUR |
| 100+ | 53.15 EUR |
| 250+ | 52.15 EUR |
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Technische Details 210-2599-00-0602 3M Electronic Solutions Division
Description: CONN SOCKET SIP ZIF 10POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (1 x 10), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 210-2599-00-0602
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
210-2599-00-0602 | 3M |
Description: CONN SOCKET SIP ZIF 10POS GOLD Packaging: Bulk Mounting Type: Through Hole Type: SIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 210-2599-00-0602 |
|
Hersteller: 3M
Description: CONN SOCKET SIP ZIF 10POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SIP ZIF 10POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH