
210-2599-00-0602 3M Electronic Solutions Division

IC & Component Sockets .1" INLINE ZIP STRIP Socket 10 Contct Qt
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 73.13 EUR |
10+ | 64.45 EUR |
30+ | 61.55 EUR |
50+ | 58.94 EUR |
100+ | 58.82 EUR |
250+ | 57.6 EUR |
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Technische Details 210-2599-00-0602 3M Electronic Solutions Division
Description: CONN SOCKET SIP ZIF 10POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (1 x 10), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 210-2599-00-0602 nach Preis ab 59.26 EUR bis 75.35 EUR
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210-2599-00-0602 | Hersteller : 3M |
![]() Packaging: Bulk Mounting Type: Through Hole Type: SIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 47 Stücke: Lieferzeit 10-14 Tag (e) |
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210-2599-00-0602 | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
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210-2599-00-0602 | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |