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210-47-314-41-001000

210-47-314-41-001000 Mill-Max


MMMC_S_A0003301958_1-2554794.pdf Hersteller: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET
auf Bestellung 408 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
19+2.76 EUR
24+ 2.19 EUR
112+ 1.9 EUR
504+ 1.71 EUR
1008+ 1.52 EUR
2520+ 1.33 EUR
10024+ 1.24 EUR
Mindestbestellmenge: 19
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Technische Details 210-47-314-41-001000 Mill-Max

Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.

Weitere Produktangebote 210-47-314-41-001000

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Preis ohne MwSt
210-47-314-41-001000 210-47-314-41-001000 Hersteller : Mill-Max Manufacturing Corp. 2017-11%3A099.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
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