210-47-628-41-001000 Mill-Max
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.38 EUR |
| 10+ | 3.64 EUR |
| 28+ | 3.28 EUR |
| 112+ | 3.14 EUR |
| 252+ | 2.95 EUR |
| 504+ | 2.81 EUR |
| 1008+ | 2.68 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details 210-47-628-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 28POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 210-47-628-41-001000 nach Preis ab 3.05 EUR bis 4.5 EUR
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210-47-628-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Closed Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 308 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 210-47-628-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 308 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.5 EUR |
| 14+ | 3.74 EUR |
| 28+ | 3.56 EUR |
| 56+ | 3.38 EUR |
| 112+ | 3.22 EUR |
| 252+ | 3.05 EUR |


