2100-6310-9UA-1902 3M
Hersteller: 3M
Description: 10X10 GRID ZIP SOCKET
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 100 (10 x 10)
Operating Temperature: -55°C ~ 150°C
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produktrezensionen
Produktbewertung abgeben
Technische Details 2100-6310-9UA-1902 3M
Description: 10X10 GRID ZIP SOCKET, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 100 (10 x 10), Operating Temperature: -55°C ~ 150°C, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 2100-6310-9UA-1902
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
|
|
2100-6310-9UA-1902 | 3M Electronic Solutions Division |
IC & Component Sockets 2100-6310-9UA-1902 GRID ZIP (10X10) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 2100-6310-9UA-1902 |
![]() |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 2100-6310-9UA-1902 GRID ZIP (10X10)
IC & Component Sockets 2100-6310-9UA-1902 GRID ZIP (10X10)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH

