214-3339-00-0602J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions DivisionIC & Component Sockets 0.100" DIP SOCKET 14 Contact Qty.
auf Bestellung 519 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 37.35 EUR |
| 10+ | 32.72 EUR |
| 20+ | 31.29 EUR |
| 50+ | 30.29 EUR |
| 100+ | 29.29 EUR |
| 200+ | 27.67 EUR |
| 500+ | 26.86 EUR |
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Technische Details 214-3339-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 14POS GLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 214-3339-00-0602J nach Preis ab 27.86 EUR bis 37.63 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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214-3339-00-0602J | Hersteller : 3M |
Description: CONN IC DIP SOCKET ZIF 14POS GLD Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 413 Stücke: Lieferzeit 10-14 Tag (e) |
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214-3339-00-0602J | Hersteller : 3M |
Description: 3M - 214-3339-00-0602J - IC- & Baustein-Sockel, 14 Kontakt(e), DIP-Sockel, 2.54 mm, Text Tool, 7.62 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP-Sockel rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 14Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: Text Tool SVHC: No SVHC (20-Jun-2016) |
auf Bestellung 34 Stücke: Lieferzeit 14-21 Tag (e) |
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214-3339-00-0602J | Hersteller : 3M Interconnect Solutions |
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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| 214-3339-00-0602J | Hersteller : 3M Interconnect Solutions |
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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214-3339-00-0602J | Hersteller : 3M Interconnect Solutions |
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |