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214-99-632-01-670800

214-99-632-01-670800 Mill-Max Manufacturing Corp.

2017-11%3A108.pdf Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS TINLEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 1504 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6 EUR
12+ 5.45 EUR
36+ 5.16 EUR
60+ 5.04 EUR
108+ 4.8 EUR
252+ 4.2 EUR
504+ 4.08 EUR
1008+ 3.48 EUR
Mindestbestellmenge: 3
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Technische Details 214-99-632-01-670800 Mill-Max Manufacturing Corp.

Description: CONN IC DIP SOCKET 32POS TINLEAD, Features: Closed Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.

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214-99-632-01-670800 214-99-632-01-670800 Hersteller : Mill-Max MMMC_S_A0004811378_1-2556431.pdf IC & Component Sockets 32P SMD IC SOCKET
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