214-99-632-01-670800 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.Description: CONN IC DIP SOCKET 32POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 1398 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 5.88 EUR |
| 12+ | 4.94 EUR |
| 36+ | 4.57 EUR |
| 60+ | 4.41 EUR |
| 108+ | 4.23 EUR |
| 252+ | 3.98 EUR |
| 504+ | 3.79 EUR |
| 1008+ | 3.61 EUR |
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Technische Details 214-99-632-01-670800 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS TINLEAD, Packaging: Tube, Features: Closed Frame, Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 214-99-632-01-670800
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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214-99-632-01-670800 | Hersteller : Mill-Max |
IC & Component Sockets 32P SMD IC SOCKET |
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