216-3340-00-0602J
Produktcode: 162302
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Lieblingsprodukt
Hersteller:
Steckverbinder, Reihenklemmen > Plattenverbinder
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Weitere Produktangebote 216-3340-00-0602J nach Preis ab 30.84 EUR bis 54.6 EUR
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216-3340-00-0602J | 3M Electronic Solutions Division |
IC & Component Sockets 0.100" DIP SOCKET 16 Contact Qty. |
auf Bestellung 121 Stücke: Lieferzeit 10-14 Tag (e) |
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216-3340-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 16POS GLD Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 151 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 216-3340-00-0602J |
|
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 16 Contact Qty.
IC & Component Sockets 0.100" DIP SOCKET 16 Contact Qty.
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.93 EUR |
| 10+ | 33.9 EUR |
| 20+ | 31.37 EUR |
| 50+ | 30.84 EUR |
| 216-3340-00-0602J |
|
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 16POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 16POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 151 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 54.6 EUR |
| 10+ | 46.4 EUR |
| 30+ | 42.94 EUR |
| 50+ | 41.41 EUR |
| 100+ | 39.44 EUR |