216-6278-00-3303 3M Electronic Solutions Division
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Technische Details 216-6278-00-3303 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 16POS GLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polyether Imide (PEI), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 250.0µin (6.35µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 250.0µin (6.35µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 216-6278-00-3303
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 216-6278-00-3303 | Hersteller : 3M Interconnect Solutions |
 Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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216-6278-00-3303 | Hersteller : 3M |
Description: CONN IC DIP SOCKET ZIF 16POS GLD Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyether Imide (PEI), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 250.0µin (6.35µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 250.0µin (6.35µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |