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2174988-1 TE Connectivity

DDEController?Action=srchrtrv&DocNm=2174988&DocType=Customer+Drawing&DocLang=English Hersteller: TE Connectivity
Category: Unclassified
Description: 2174988-1
auf Bestellung 100 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis ohne MwSt
2+67.38 EUR
8+ 59.53 EUR
15+ 58.4 EUR
29+ 57.29 EUR
Mindestbestellmenge: 2
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Technische Details 2174988-1 TE Connectivity

Description: CONN SOCKET LGA 2011POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: LGA, Number of Positions or Pins (Grid): 2011 (47 x 58), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.035" (0.90mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Material - Post: Copper Alloy.

Weitere Produktangebote 2174988-1

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
2174988-1 2174988-1 Hersteller : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=2174988&DocType=Customer+Drawing&DocLang=English Description: CONN SOCKET LGA 2011POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: LGA
Number of Positions or Pins (Grid): 2011 (47 x 58)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.040" (1.02mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.035" (0.90mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Material - Post: Copper Alloy
Produkt ist nicht verfügbar
2174988-1 2174988-1 Hersteller : TE Connectivity ENG_CD_2174988_C1-2028984.pdf Memory Card Connectors SOCKET ASSY LGA2011-1 0.38Au
Produkt ist nicht verfügbar