2174988-1 TE CONNECTIVITY / PARTNER STOCK
Hersteller: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 2174988-1 - IC AND COMPONENT SOCKETS
tariffCode: 85366990
productTraceability: Yes-Date/Lot Code
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: No SVHC (27-Jun-2024)
Produktrezensionen
Produktbewertung abgeben
Technische Details 2174988-1 TE CONNECTIVITY / PARTNER STOCK
Description: CONN SOCKET LGA 2011POS GOLD, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Finish - Post: Gold, Pitch - Post: 0.035" (0.90mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.040" (1.02mm), Housing Material: Thermoplastic, Termination: Solder, Number of Positions or Pins (Grid): 2011 (47 x 58), Type: LGA, Mounting Type: Surface Mount, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 2174988-1
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
2174988-1 | TE Connectivity AMP Connectors |
Description: CONN SOCKET LGA 2011POS GOLD Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 15.0µin (0.38µm) Contact Finish - Post: Gold Pitch - Post: 0.035" (0.90mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold Pitch - Mating: 0.040" (1.02mm) Housing Material: Thermoplastic Termination: Solder Number of Positions or Pins (Grid): 2011 (47 x 58) Type: LGA Mounting Type: Surface Mount Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
2174988-1 | TE Connectivity |
Memory Card Connectors SOCKET ASSY LGA2011-1 0.38Au |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 2174988-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: CONN SOCKET LGA 2011POS GOLD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Pitch - Post: 0.035" (0.90mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.040" (1.02mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 2011 (47 x 58)
Type: LGA
Mounting Type: Surface Mount
Features: Closed Frame
Packaging: Bulk
Description: CONN SOCKET LGA 2011POS GOLD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Pitch - Post: 0.035" (0.90mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.040" (1.02mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 2011 (47 x 58)
Type: LGA
Mounting Type: Surface Mount
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2174988-1 |
|
Hersteller: TE Connectivity
Memory Card Connectors SOCKET ASSY LGA2011-1 0.38Au
Memory Card Connectors SOCKET ASSY LGA2011-1 0.38Au
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH