2174988-2 TE CONNECTIVITY / PARTNER STOCK
Hersteller: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 2174988-2 - IC COMPONENT SOCKETS CONNECTORS
tariffCode: 85366990
productTraceability: No
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: To Be Advised
Produktrezensionen
Produktbewertung abgeben
Technische Details 2174988-2 TE CONNECTIVITY / PARTNER STOCK
Description: CONN SOCKET LGA 2011POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: LGA, Number of Positions or Pins (Grid): 2011 (47 x 58), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.035" (0.90mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 2174988-2
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
2174988-2 | TE Connectivity AMP Connectors |
Description: CONN SOCKET LGA 2011POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: LGA Number of Positions or Pins (Grid): 2011 (47 x 58) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.040" (1.02mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.035" (0.90mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Copper Alloy |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
2174988-2 | TE Connectivity |
Memory Card Connectors SOCKET ASSY LGA2011-1 0.76um Au |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 2174988-2 |
|
Hersteller: TE Connectivity AMP Connectors
Description: CONN SOCKET LGA 2011POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: LGA
Number of Positions or Pins (Grid): 2011 (47 x 58)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.040" (1.02mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.035" (0.90mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Copper Alloy
Description: CONN SOCKET LGA 2011POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: LGA
Number of Positions or Pins (Grid): 2011 (47 x 58)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.040" (1.02mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.035" (0.90mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Copper Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2174988-2 |
|
Hersteller: TE Connectivity
Memory Card Connectors SOCKET ASSY LGA2011-1 0.76um Au
Memory Card Connectors SOCKET ASSY LGA2011-1 0.76um Au
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH