2174988-2 TE CONNECTIVITY / PARTNER STOCK
Hersteller: TE CONNECTIVITY / PARTNER STOCKDescription: TE CONNECTIVITY / PARTNER STOCK - 2174988-2 - IC COMPONENT SOCKETS CONNECTORS
tariffCode: 85366990
productTraceability: No
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: To Be Advised
auf Bestellung 142 Stücke:
Lieferzeit 14-21 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details 2174988-2 TE CONNECTIVITY / PARTNER STOCK
Description: CONN SOCKET LGA 2011POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: LGA, Number of Positions or Pins (Grid): 2011 (47 x 58), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.040" (1.02mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.035" (0.90mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 2174988-2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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2174988-2 | Hersteller : TE Connectivity |
SOCKET ASSY LGA2011-1 0.76um Au |
Produkt ist nicht verfügbar |
|
 |
2174988-2 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN SOCKET LGA 2011POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: LGA Number of Positions or Pins (Grid): 2011 (47 x 58) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.040" (1.02mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.035" (0.90mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Copper Alloy |
Produkt ist nicht verfügbar |
|
 |
2174988-2 | Hersteller : TE Connectivity |
Memory Card Connectors SOCKET ASSY LGA2011-1 0.76um Au |
Produkt ist nicht verfügbar |