218-3341-00-0602J

218-3341-00-0602J 3M Electronic Solutions Division


2cd3aad061e88fa5fffa81fd9cf1f5c3f8dc8ac1-2951973.pdf Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 18 Contact Qty.
auf Bestellung 18 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+41.08 EUR
5+ 38.88 EUR
10+ 37.08 EUR
20+ 35.53 EUR
50+ 33.32 EUR
100+ 32.19 EUR
200+ 30.43 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details 218-3341-00-0602J 3M Electronic Solutions Division

Description: CONN IC DIP SOCKET ZIF 18POS GLD, Features: Closed Frame, Packaging: Tray, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.

Weitere Produktangebote 218-3341-00-0602J

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
218-3341-00-0602J 218-3341-00-0602J Hersteller : 3M Interconnect Solutions ts0365.pdf.pdf Conn DIP Socket SKT 18 POS 2.54mm Solder ST Thru-Hole Box
Produkt ist nicht verfügbar
218-3341-00-0602J 218-3341-00-0602J Hersteller : 3M Interconnect Solutions ts0365.pdf.pdf Conn DIP Socket SKT 18 POS 2.54mm Solder ST Thru-Hole Box
Produkt ist nicht verfügbar
218-3341-00-0602J 218-3341-00-0602J Hersteller : 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 18POS GLD
Features: Closed Frame
Packaging: Tray
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar