218-3341-00-0602J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 18 Contact Qty.
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Technische Details 218-3341-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 18POS GLD, Packaging: Tray, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 218-3341-00-0602J nach Preis ab 33.99 EUR bis 39.99 EUR
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218-3341-00-0602J | Hersteller : 3M |
Description: CONN IC DIP SOCKET ZIF 18POS GLD Packaging: Tray Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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