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218-7223-55-1902

218-7223-55-1902 3M Electronic Solutions Division

ts0338.pdf
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets BURN-IN SOIC SOCKET 18 Leads
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+66.99 EUR
10+58.24 EUR
20+48.66 EUR
50+46.31 EUR
100+46.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 218-7223-55-1902 3M Electronic Solutions Division

Description: CONN SOCKET SOIC 18POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Material - Mating: Beryllium Copper, Housing Material: Polyethersulfone (PES), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 150°C, Type: SOIC, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Finish - Mating: Gold.

Weitere Produktangebote 218-7223-55-1902

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Preis
218-7223-55-1902 218-7223-55-1902 3M 3mtm-textooltm-soic-test-and-burn-in-socket-ts0338.pdf Description: CONN SOCKET SOIC 18POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Finish - Mating: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
218-7223-55-1902 3mtm-textooltm-soic-test-and-burn-in-socket-ts0338.pdf
218-7223-55-1902
Hersteller: 3M
Description: CONN SOCKET SOIC 18POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Finish - Mating: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH