218-7223-55-1902 3M Electronic Solutions Division
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 67.85 EUR |
10+ | 57.66 EUR |
20+ | 56.74 EUR |
50+ | 53.2 EUR |
100+ | 51.6 EUR |
200+ | 48.42 EUR |
500+ | 47.22 EUR |
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Technische Details 218-7223-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 18POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 218-7223-55-1902
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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218-7223-55-1902 | Hersteller : 3M Interconnect Solutions | Conn SOIC Test Clip SKT 18 POS Solder ST Thru-Hole 18 Port Box |
Produkt ist nicht verfügbar |
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218-7223-55-1902 | Hersteller : 3M Interconnect Solutions | Conn SOIC Test Clip SKT 18 POS Solder ST Thru-Hole 18 Port Box |
Produkt ist nicht verfügbar |
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218-7223-55-1902 | Hersteller : 3M |
Description: CONN SOCKET SOIC 18POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |