220-3342-00-0602J 3M
Hersteller: 3MDescription: CONN IC DIP SOCKET ZIF 20POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 421 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 38.4 EUR |
| 10+ | 32.63 EUR |
| 30+ | 30.2 EUR |
| 50+ | 29.13 EUR |
| 100+ | 27.74 EUR |
| 250+ | 26 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 220-3342-00-0602J 3M
Description: CONN IC DIP SOCKET ZIF 20POS GLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
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Conn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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2203342000602J | Hersteller : 3M Interconnect Solutions |
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