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224-7397-55-1902

224-7397-55-1902 3M Electronic Solutions Division

3mtm-textooltm-soic-test-and-burn-in-socket-ts0338.pdf
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets BURN-IN SOIC SOCKET 24 Leads
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+77 EUR
10+65.44 EUR
20+60.19 EUR
50+58.06 EUR
100+55.42 EUR
200+54.7 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 224-7397-55-1902 3M Electronic Solutions Division

Description: CONN SOCKET SOIC 24POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Housing Material: Polyethersulfone (PES), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 150°C, Type: SOIC, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

Weitere Produktangebote 224-7397-55-1902

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Preis
224-7397-55-1902 224-7397-55-1902 3M 3mtm-textooltm-soic-test-and-burn-in-socket-ts0338.pdf Description: CONN SOCKET SOIC 24POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 20 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
224-7397-55-1902 3mtm-textooltm-soic-test-and-burn-in-socket-ts0338.pdf
224-7397-55-1902
Hersteller: 3M
Description: CONN SOCKET SOIC 24POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 20 Stücke
Im Einkaufswagen  Stück im Wert von  UAH