224-7397-55-1902 3M Electronic Solutions Division
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 73.71 EUR |
| 5+ | 73.67 EUR |
| 10+ | 67 EUR |
| 20+ | 65.03 EUR |
| 50+ | 62.87 EUR |
| 100+ | 59.4 EUR |
| 200+ | 57.66 EUR |
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Technische Details 224-7397-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 24POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 224-7397-55-1902
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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224-7397-55-1902 | Hersteller : 3M Interconnect Solutions |
 Conn SOIC Test Clip SKT 24 POS Solder ST Thru-Hole 1 Port Textool™ Box |
Produkt ist nicht verfügbar |
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224-7397-55-1902 | Hersteller : 3M Interconnect Solutions |
Conn SOIC Test Clip SKT 24 POS Solder ST Thru-Hole 1 Port Textool™ Box |
Produkt ist nicht verfügbar |
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| 224-7397-55-1902 | Hersteller : 3M Interconnect Solutions |
Conn SOIC Test Clip SKT 24 POS Solder ST Thru-Hole 1 Port Textool™ Box |
Produkt ist nicht verfügbar |
||
 |
224-7397-55-1902 | Hersteller : 3M |
Description: CONN SOCKET SOIC 24POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |