224-7397-55-1902 3M Electronic Solutions Division
| Anzahl | Preis |
|---|---|
| 1+ | 71.65 EUR |
| 10+ | 61 EUR |
| 30+ | 55.67 EUR |
| 50+ | 54.49 EUR |
| 100+ | 52.73 EUR |
| 250+ | 51.62 EUR |
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Technische Details 224-7397-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 24POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 224-7397-55-1902
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224-7397-55-1902 | Hersteller : 3M |
Description: CONN SOCKET SOIC 24POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyethersulfone (PES), Glass Filled Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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