225-PLS18003-12 Aries Electronics

Description: ZIF PGA SOCKET 225 PIN 18 X 18, Features: Closed Frame, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Number of Positions or Pins (Grid): 225 (15 x 15), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.