228-1371-00-0602J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions DivisionIC & Component Sockets 0.100" DIP SOCKET 28 Contact Qty.
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 52.06 EUR |
| 10+ | 44.16 EUR |
| 30+ | 43.35 EUR |
| 50+ | 42.03 EUR |
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Technische Details 228-1371-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Packaging: Tray, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 228-1371-00-0602J
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Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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228-1371-00-0602J | Hersteller : 3M |
Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |
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| 228-1371-00-0602J | Hersteller : 3M Interconnect Solutions |
Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |
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228-1371-00-0602J | Hersteller : 3M Interconnect Solutions |
Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |
|
 |
228-1371-00-0602J | Hersteller : 3M |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Packaging: Tray Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |