228-4817-00-0602J 3M

Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 50.81 EUR |
10+ | 43.19 EUR |
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Technische Details 228-4817-00-0602J 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 228-4817-00-0602J
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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228-4817-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
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228-4817-00-0602J | Hersteller : 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
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228-4817-00-0602J | Hersteller : 3M Electronic Solutions Division |
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Produkt ist nicht verfügbar |