232-1270-02-0602 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions DivisionIC & Component Sockets .050X.100 ZIPSTP SKT 32 CONTACTS PTRN 2
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 76.10 EUR |
| 5+ | 72.02 EUR |
| 10+ | 68.71 EUR |
| 20+ | 65.82 EUR |
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Technische Details 232-1270-02-0602 3M Electronic Solutions Division
Description: CONN SOCKET PGA ZIF 32POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 232-1270-02-0602
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232-1270-02-0602 | Hersteller : 3M Interconnect Solutions |
Conn ZIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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| 232-1270-02-0602 | Hersteller : 3M Interconnect Solutions |
Conn ZIP Socket SKT 32 POS 2.54mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
||
| 232-1270-02-0602 | Hersteller : 3M |
Description: CONN SOCKET PGA ZIF 32POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |