232-1270-02-0602 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets .050X.100 ZIPSTP SKT 32 CONTACTS PTRN 2
| Anzahl | Privatkunde |
|---|---|
| 1+ | 90.56 EUR |
| 5+ | 85.7 EUR |
| 10+ | 81.76 EUR |
| 20+ | 78.33 EUR |
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10-14 Tag (e)
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Technische Details 232-1270-02-0602 3M Electronic Solutions Division
Description: CONN SOCKET PGA ZIF 32POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 232-1270-02-0602
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| 232-1270-02-0602 | 3M |
Description: CONN SOCKET PGA ZIF 32POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 232-1270-02-0602 |
|
Hersteller: 3M
Description: CONN SOCKET PGA ZIF 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH