232-1291-00-0602J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
| Anzahl | Preis |
|---|---|
| 1+ | 61.12 EUR |
| 10+ | 51.94 EUR |
| 20+ | 47.82 EUR |
| 50+ | 46.83 EUR |
| 100+ | 45.9 EUR |
| 200+ | 44.81 EUR |
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Technische Details 232-1291-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 32POS GLD, Termination: Press-Fit, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Pitch - Mating: 0.070" (1.78mm), Housing Material: Polysulfone (PSU), Glass Filled, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Mounting Type: Connector, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 232-1291-00-0602J
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
232-1291-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 32POS GLD Termination: Press-Fit Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -55°C ~ 125°C Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Pitch - Mating: 0.070" (1.78mm) Housing Material: Polysulfone (PSU), Glass Filled Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Mounting Type: Connector Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 20 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 232-1291-00-0602J |
|
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Termination: Press-Fit
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Pitch - Mating: 0.070" (1.78mm)
Housing Material: Polysulfone (PSU), Glass Filled
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Mounting Type: Connector
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Termination: Press-Fit
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Pitch - Mating: 0.070" (1.78mm)
Housing Material: Polysulfone (PSU), Glass Filled
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Mounting Type: Connector
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 20 Stücke
Im Einkaufswagen
Stück im Wert von UAH