232-1291-00-0602J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions DivisionIC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 63.08 EUR |
| 10+ | 54.84 EUR |
| 30+ | 45.27 EUR |
| 50+ | 44.55 EUR |
| 100+ | 43.81 EUR |
| 250+ | 43.60 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 232-1291-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 32POS GLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 232-1291-00-0602J
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
232-1291-00-0602J | Hersteller : 3M |
Description: CONN IC DIP SOCKET ZIF 32POS GLD Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |