232-2601-00-0602 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets .1" INLINE ZIP STRIP Socket 32 Contct Qt
| Anzahl | Preis |
|---|---|
| 1+ | 96.43 EUR |
| 10+ | 81.59 EUR |
| 30+ | 75.36 EUR |
| 50+ | 71.65 EUR |
| 100+ | 71 EUR |
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Technische Details 232-2601-00-0602 3M Electronic Solutions Division
Description: CONN SOCKET SIP ZIF 32POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polysulfone (PSU), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (1 x 32), Operating Temperature: -55°C ~ 125°C, Type: SIP, ZIF (ZIP), Mounting Type: Through Hole, Packaging: Bulk.
Weitere Produktangebote 232-2601-00-0602
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
|
232-2601-00-0602 | 3M |
Description: CONN SOCKET SIP ZIF 32POS GOLDPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polysulfone (PSU), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (1 x 32) Operating Temperature: -55°C ~ 125°C Type: SIP, ZIF (ZIP) Mounting Type: Through Hole Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 232-2601-00-0602 |
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Hersteller: 3M
Description: CONN SOCKET SIP ZIF 32POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polysulfone (PSU), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (1 x 32)
Operating Temperature: -55°C ~ 125°C
Type: SIP, ZIF (ZIP)
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN SOCKET SIP ZIF 32POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polysulfone (PSU), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (1 x 32)
Operating Temperature: -55°C ~ 125°C
Type: SIP, ZIF (ZIP)
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH

