2327B-TACHG Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details 2327B-TACHG Boyd Laconia, LLC
Description: THM,2327B-TACHG, Packaging: Bulk, Material: Aluminum, Length: 1.105" (28.07mm), Shape: Rectangular, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, FPGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2W @ 50°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM, Fin Height: 0.600" (15.24mm), Material Finish: Black Anodized.
Weitere Produktangebote 2327B-TACHG
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
2327B-TACHG | Hersteller : Aavid |
 Heat Sinks Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 27.9x28.1x15.2mm, IC Pkg Size = 28 x 28, Tape #32 |
Produkt ist nicht verfügbar |