Produkte > 3M INTERCONNECT SOLUTIONS > 234-3034-51-0602

234-3034-51-0602 3M Interconnect Solutions


Hersteller: 3M Interconnect Solutions
JE150378550 234-3034-51-0602=ZIPSTRIP""WITHGANGBAR""
Produkt ist nicht verfügbar

Produktrezensionen
Produktbewertung abgeben

Technische Details 234-3034-51-0602 3M Interconnect Solutions

Description: CONN ZIG-ZAG ZIF 34POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: Zig-Zag, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 34 (2 x 17), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.

Weitere Produktangebote 234-3034-51-0602

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
234-3034-51-0602 Hersteller : 3M Description: CONN ZIG-ZAG ZIF 34POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: Zig-Zag, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
234-3034-51-0602 Hersteller : 3M Electronic Solutions Division IC & Component Sockets ZPSTRP"W/ GANG BAR"
Produkt ist nicht verfügbar