24-4518-10

24-4518-10 Aries Electronics


518_Series.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 380 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.56 EUR
10+4.72 EUR
25+4.42 EUR
50+4.21 EUR
100+4.01 EUR
250+3.76 EUR
Mindestbestellmenge: 4
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Technische Details 24-4518-10 Aries Electronics

Description: CONN IC DIP SOCKET 24POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Type: DIP, 0.4" (10.16mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.

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24-4518-10 24-4518-10 Hersteller : Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket-336841.pdf IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 24 PINS
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