24-516-11

24-516-11 Aries Electronics


10017-dip-zif-test-socket-365302.pdf Hersteller: Aries Electronics
IC & Component Sockets 24-PIN ZIF SOCKET
auf Bestellung 4 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.24 EUR
10+20.03 EUR
30+16.70 EUR
255+16.14 EUR
510+15.61 EUR
1005+15.05 EUR
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Technische Details 24-516-11 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 24POS GLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper.

Weitere Produktangebote 24-516-11

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
24-516-11 24-516-11 Hersteller : Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH