242-1281-00-0602J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 42 Contact Qty.
| Anzahl | Preis |
|---|---|
| 1+ | 47.31 EUR |
| 10+ | 41.18 EUR |
| 20+ | 38.1 EUR |
| 50+ | 35.06 EUR |
| 100+ | 33.69 EUR |
| 200+ | 32.26 EUR |
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Technische Details 242-1281-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 42POS GLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 42 (2 x 21), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 242-1281-00-0602J nach Preis ab 47.54 EUR bis 47.54 EUR
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242-1281-00-0602J | Hersteller : 3M |
Description: CONN IC DIP SOCKET ZIF 42POS GLDFeatures: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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