2445893-1 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP ConnectorsDescription: DIP IC SOCKET 8P SMT
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 500+ | 1.13 EUR |
| 1000+ | 1.06 EUR |
| 1500+ | 1.02 EUR |
| 2500+ | 0.98 EUR |
| 3500+ | 0.95 EUR |
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Technische Details 2445893-1 TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P SMT, Features: Open Frame, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 2445893-1 nach Preis ab 1.07 EUR bis 1.95 EUR
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2445893-1 | Hersteller : TE Connectivity |
IC & Component Sockets DIP IC SOCKET 8P SMT |
auf Bestellung 4424 Stücke: Lieferzeit 10-14 Tag (e) |
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2445893-1 | Hersteller : TE Connectivity AMP Connectors |
Description: DIP IC SOCKET 8P SMT Features: Open Frame Packaging: Cut Tape (CT) Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Material - Post: Copper Alloy |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
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2445893-1 | Hersteller : TE CONNECTIVITY |
Description: TE CONNECTIVITY - 2445893-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung tariffCode: 85366990 productTraceability: No Kontaktüberzug: Verzinnte Kontakte Steckverbindertyp: DIP-Sockel rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Kontaktmaterial: Kupferlegierung hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: - SVHC: No SVHC (27-Jun-2024) |
auf Bestellung 4500 Stücke: Lieferzeit 14-21 Tag (e) |