| Anzahl | Preis |
|---|---|
| 259+ | 0.56 EUR |
| 262+ | 0.54 EUR |
| 263+ | 0.53 EUR |
| 264+ | 0.52 EUR |
| 500+ | 0.51 EUR |
| 1000+ | 0.5 EUR |
| 3000+ | 0.49 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 2445893-1 TE Connectivity
Description: DIP IC SOCKET 8P SMT, Packaging: Tape & Reel (TR), Features: Open Frame, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 2445893-1 nach Preis ab 0.43 EUR bis 1.9 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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2445893-1 | TE Connectivity |
 Connector DIP IC SOCKET 8P - SMD |
auf Bestellung 5397 Stücke: Lieferzeit 14-21 Tag (e) |
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2445893-1 | TE Connectivity AMP Connectors |
Description: DIP IC SOCKET 8P SMT Packaging: Tape & Reel (TR) Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Material - Post: Copper Alloy |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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2445893-1 | TE Connectivity |
IC & Component Sockets DIP IC SOCKET 8P SMT |
auf Bestellung 4266 Stücke: Lieferzeit 10-14 Tag (e) |
|
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2445893-1 | TE Connectivity AMP Connectors |
Description: DIP IC SOCKET 8P SMT Packaging: Cut Tape (CT) Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Material - Post: Copper Alloy |
auf Bestellung 4250 Stücke: Lieferzeit 10-14 Tag (e) |
|
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 |
2445893-1 | TE CONNECTIVITY |
Description: TE CONNECTIVITY - 2445893-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung tariffCode: 85366990 productTraceability: No Kontaktüberzug: Verzinnte Kontakte rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 8Kontakt(e) Steckverbinder: DIP-Sockel euEccn: NLR isCanonical: Y Kontaktmaterial: Kupferlegierung hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: - SVHC: Lead (21-Jan-2025) |
auf Bestellung 4424 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 2445893-1 |
|
Hersteller: TE Connectivity
Connector DIP IC SOCKET 8P - SMD
Connector DIP IC SOCKET 8P - SMD
auf Bestellung 5397 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 255+ | 0.57 EUR |
| 259+ | 0.54 EUR |
| 262+ | 0.51 EUR |
| 263+ | 0.49 EUR |
| 264+ | 0.47 EUR |
| 500+ | 0.45 EUR |
| 1000+ | 0.43 EUR |
| 2445893-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P SMT
Packaging: Tape & Reel (TR)
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
Description: DIP IC SOCKET 8P SMT
Packaging: Tape & Reel (TR)
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 500+ | 1.22 EUR |
| 1000+ | 1.16 EUR |
| 1500+ | 1.13 EUR |
| 2500+ | 1.09 EUR |
| 3500+ | 1.06 EUR |
| 2445893-1 |
|
Hersteller: TE Connectivity
IC & Component Sockets DIP IC SOCKET 8P SMT
IC & Component Sockets DIP IC SOCKET 8P SMT
auf Bestellung 4266 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.9 EUR |
| 10+ | 1.62 EUR |
| 25+ | 1.44 EUR |
| 100+ | 1.37 EUR |
| 250+ | 1.28 EUR |
| 500+ | 1.22 EUR |
| 1000+ | 1.13 EUR |
| 2445893-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 8P SMT
Packaging: Cut Tape (CT)
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
Description: DIP IC SOCKET 8P SMT
Packaging: Cut Tape (CT)
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 4250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.9 EUR |
| 11+ | 1.61 EUR |
| 25+ | 1.51 EUR |
| 50+ | 1.44 EUR |
| 100+ | 1.37 EUR |
| 250+ | 1.28 EUR |
| 2445893-1 |
|
Hersteller: TE CONNECTIVITY
Description: TE CONNECTIVITY - 2445893-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Verzinnte Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 8Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Kupferlegierung
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: Lead (21-Jan-2025)
Description: TE CONNECTIVITY - 2445893-1 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Verzinnte Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 8Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Kupferlegierung
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: Lead (21-Jan-2025)
auf Bestellung 4424 Stücke:
Lieferzeit 14-21 Tag (e)