| Anzahl | Privatkunde |
|---|---|
| 607+ | 0.29 EUR |
| 616+ | 0.27 EUR |
| 637+ | 0.26 EUR |
| 1000+ | 0.25 EUR |
| 3000+ | 0.24 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 2485267-1 TE Connectivity
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Termination: Solder, Number of Positions or Pins (Grid): 6, Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tape & Reel (TR).
Weitere Produktangebote 2485267-1 nach Preis ab 0.2 EUR bis 1.3 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
2485267-1 | TE Connectivity |
 Connector DIP IC SOCKET 6P - SMD |
auf Bestellung 5400 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||||
 |
2485267-1 | TE Connectivity AMP Connectors |
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic Termination: Solder Number of Positions or Pins (Grid): 6 Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Tape & Reel (TR) |
auf Bestellung 4600 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
2485267-1 | TE Connectivity AMP Connectors |
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic Termination: Solder Number of Positions or Pins (Grid): 6 Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Cut Tape (CT) |
auf Bestellung 5295 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
2485267-1 | TE CONNECTIVITY |
Description: TE CONNECTIVITY - 2485267-1 - IC- & Baustein-Sockel, 6 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung tariffCode: 85366990 productTraceability: No Kontaktüberzug: Hauchvergoldete Kontakte rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 6Kontakt(e) Steckverbinder: DIP-Sockel euEccn: NLR isCanonical: Y Kontaktmaterial: Kupferlegierung hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: - SVHC: Lead (21-Jan-2025) |
auf Bestellung 5270 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||||
 |
2485267-1 | TE Connectivity |
IC & Component Sockets DIP IC SOCKET 6P,GOLD FLASH-SMD |
auf Bestellung 5246 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 2485267-1 |
|
Hersteller: TE Connectivity
Connector DIP IC SOCKET 6P - SMD
Connector DIP IC SOCKET 6P - SMD
auf Bestellung 5400 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 588+ | 0.3 EUR |
| 597+ | 0.29 EUR |
| 607+ | 0.26 EUR |
| 616+ | 0.25 EUR |
| 626+ | 0.24 EUR |
| 637+ | 0.23 EUR |
| 1000+ | 0.21 EUR |
| 3000+ | 0.2 EUR |
| 2485267-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 6
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tape & Reel (TR)
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 6
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tape & Reel (TR)
auf Bestellung 4600 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 900+ | 0.63 EUR |
| 1800+ | 0.6 EUR |
| 2700+ | 0.58 EUR |
| 4500+ | 0.56 EUR |
| 2485267-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 6
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Cut Tape (CT)
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 6
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Cut Tape (CT)
auf Bestellung 5295 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 20+ | 1.07 EUR |
| 24+ | 0.9 EUR |
| 25+ | 0.84 EUR |
| 50+ | 0.81 EUR |
| 100+ | 0.77 EUR |
| 250+ | 0.73 EUR |
| 2485267-1 |
|
Hersteller: TE CONNECTIVITY
Description: TE CONNECTIVITY - 2485267-1 - IC- & Baustein-Sockel, 6 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Hauchvergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 6Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Kupferlegierung
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: Lead (21-Jan-2025)
Description: TE CONNECTIVITY - 2485267-1 - IC- & Baustein-Sockel, 6 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Hauchvergoldete Kontakte
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 6Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Kupferlegierung
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: Lead (21-Jan-2025)
auf Bestellung 5270 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 231+ | 1.08 EUR |
| 285+ | 0.82 EUR |
| 297+ | 0.73 EUR |
| 500+ | 0.69 EUR |
| 1000+ | 0.67 EUR |
| 2500+ | 0.64 EUR |
| 2485267-1 |
|
Hersteller: TE Connectivity
IC & Component Sockets DIP IC SOCKET 6P,GOLD FLASH-SMD
IC & Component Sockets DIP IC SOCKET 6P,GOLD FLASH-SMD
auf Bestellung 5246 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.3 EUR |
| 10+ | 1.09 EUR |
| 25+ | 0.99 EUR |
| 100+ | 0.93 EUR |
| 250+ | 0.8 EUR |
| 900+ | 0.74 EUR |
| 1800+ | 0.69 EUR |