2485267-1 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 6
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 900+ | 0.53 EUR |
| 1800+ | 0.5 EUR |
| 2700+ | 0.49 EUR |
| 4500+ | 0.47 EUR |
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Technische Details 2485267-1 TE Connectivity AMP Connectors
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Termination: Solder, Number of Positions or Pins (Grid): 6, Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tape & Reel (TR).
Weitere Produktangebote 2485267-1 nach Preis ab 0.53 EUR bis 0.9 EUR
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2485267-1 | TE Connectivity |
IC & Component Sockets DIP IC SOCKET 6P,GOLD FLASH-SMD |
auf Bestellung 5328 Stücke: Lieferzeit 10-14 Tag (e) |
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2485267-1 | TE Connectivity AMP Connectors |
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 78.7µin (2.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic Termination: Solder Number of Positions or Pins (Grid): 6 Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Cut Tape (CT) |
auf Bestellung 5295 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 2485267-1 |
|
Hersteller: TE Connectivity
IC & Component Sockets DIP IC SOCKET 6P,GOLD FLASH-SMD
IC & Component Sockets DIP IC SOCKET 6P,GOLD FLASH-SMD
auf Bestellung 5328 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 0.74 EUR |
| 10+ | 0.68 EUR |
| 25+ | 0.65 EUR |
| 100+ | 0.62 EUR |
| 250+ | 0.59 EUR |
| 900+ | 0.54 EUR |
| 1800+ | 0.53 EUR |
| 2485267-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 6
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Cut Tape (CT)
Description: DIP IC SOCKET 6P,GOLD FLASH-SMD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 6
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Cut Tape (CT)
auf Bestellung 5295 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 20+ | 0.9 EUR |
| 24+ | 0.76 EUR |
| 25+ | 0.71 EUR |
| 50+ | 0.68 EUR |
| 100+ | 0.65 EUR |
| 250+ | 0.61 EUR |