2485267-3

2485267-3 TE Connectivity AMP Connectors


DDEController?Action=srchrtrv&DocNm=108-160876&DocType=Specification+Or+Standard&DocLang=English&DocFormat=pdf&PartCntxt=2485267-3 Hersteller: TE Connectivity AMP Connectors
Description: DIP IC SOCKET 10P,GOLD FLASH-SMD
Packaging: Tape & Reel (TR)
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 4500 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
900+0.58 EUR
1800+0.55 EUR
2700+0.54 EUR
Mindestbestellmenge: 900
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 2485267-3 TE Connectivity AMP Connectors

Description: DIP IC SOCKET 10P,GOLD FLASH-SMD, Packaging: Tape & Reel (TR), Features: Open Frame, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Material - Post: Copper Alloy.

Weitere Produktangebote 2485267-3 nach Preis ab 0.79 EUR bis 1.16 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
2485267-3 2485267-3 Hersteller : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=108-160876&DocType=Specification+Or+Standard&DocLang=English&DocFormat=pdf&PartCntxt=2485267-3 Description: DIP IC SOCKET 10P,GOLD FLASH-SMD
Packaging: Cut Tape (CT)
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Copper Alloy
auf Bestellung 5396 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+1.16 EUR
18+0.99 EUR
25+0.93 EUR
50+0.89 EUR
100+0.85 EUR
250+0.79 EUR
Mindestbestellmenge: 16
Im Einkaufswagen  Stück im Wert von  UAH
2485267-3 2485267-3 Hersteller : TE Connectivity dnd-br-dip-socket-en-0724-final.pdf Conn DIP IC SOCKET 10P - SMD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2485267-3 2485267-3 Hersteller : TE Connectivity dnd-br-dip-socket-en-0724-final.pdf Conn DIP IC SOCKET 10P - SMD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
2485267-3 2485267-3 Hersteller : TE Connectivity DDEController?Action=srchrtrv&DocNm=108-160876&DocType=Specification+Or+Standard&DocLang=English&DocFormat=pdf&PartCntxt=2485267-3 IC & Component Sockets DIP IC SOCKET 10P,GOLD FLASH-SMD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH