25MF225KB13225 Rubycon
Hersteller: Rubycon
Description: CAP FILM 2.2UF 10% 25VDC 1210
Packaging: Cut Tape (CT)
Tolerance: ±10%
Features: High Temperature
Package / Case: 1210 (3225 Metric)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Termination: Solder Pads
Dielectric Material: Polymer, Metallized
Voltage Rating - DC: 16V
Height - Seated (Max): 0.063" (1.60mm)
Capacitance: 2.2 µF
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
| Anzahl | Preis |
|---|---|
| 3+ | 8.59 EUR |
| 10+ | 6.26 EUR |
| 50+ | 5.33 EUR |
| 100+ | 5.04 EUR |
| 500+ | 4.61 EUR |
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Technische Details 25MF225KB13225 Rubycon
Description: CAP FILM 2.2UF 10% 25VDC 1210, Packaging: Tape & Reel (TR), Tolerance: ±10%, Features: High Temperature, Package / Case: 1210 (3225 Metric), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Applications: General Purpose, Termination: Solder Pads, Dielectric Material: Polymer, Metallized, Voltage Rating - DC: 16V, Height - Seated (Max): 0.063" (1.60mm), Capacitance: 2.2 µF, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm).
Weitere Produktangebote 25MF225KB13225
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25MF225KB13225 | Hersteller : Rubycon |
Description: CAP FILM 2.2UF 10% 25VDC 1210 Packaging: Tape & Reel (TR) Tolerance: ±10% Features: High Temperature Package / Case: 1210 (3225 Metric) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Applications: General Purpose Termination: Solder Pads Dielectric Material: Polymer, Metallized Voltage Rating - DC: 16V Height - Seated (Max): 0.063" (1.60mm) Capacitance: 2.2 µF Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) |
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