260-5204-01 3M
Hersteller: 3MDescription: CONN SOCKET QFN 60POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 60 (4 x 15)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.020" (0.50mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
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Technische Details 260-5204-01 3M
Description: CONN SOCKET QFN 60POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: QFN, Number of Positions or Pins (Grid): 60 (4 x 15), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.020" (0.50mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 260-5204-01
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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260-5204-01 | Hersteller : 3M Electronic Solutions Division |
IC & Component Sockets Textool QFN .5MM,60P ODD ROW, W/THRML PIN |
Produkt ist nicht verfügbar |