264-1300-29-0602J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions DivisionIC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 66.76 EUR |
| 10+ | 45.67 EUR |
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Technische Details 264-1300-29-0602J 3M Electronic Solutions Division
Description: 3M TEXTOOL RECEPTACLES FOR DIP S, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.8" (20.32mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 64 (2 x 32), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 264-1300-29-0602J
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 264-1300-29-0602J | Hersteller : 3M Interconnect Solutions |
Conn DIP Socket SKT 64 POS 1.78mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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| 264-1300-29-0602J | Hersteller : 3M |
Description: 3M TEXTOOL RECEPTACLES FOR DIP S Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.8" (20.32mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |